Micron Technology
Micron Technology is hiring a Memory Hardware Design Engineer to work on DRAM, NAND Flash, or HBM memory products and the interface circuitry that connects them to CPUs and SoCs. You will contribute to designs that define the memory bandwidth and density capabilities of data center servers, smartphones, and automotive systems.
Micron's hardware design teams work on sense amplifiers, row/column decoders, I/O interface circuits, and on-die ECC logic for DRAM and NAND products. You will be part of a design team that takes a memory array from architecture to silicon, working within Micron's proprietary process technology. The interface circuits group also designs DDR5 and LPDDR5 PHY circuits that must operate at multi-Gbps data rates with sub-nanosecond timing margins.
Engineers interested in the physics of memory cells and the circuit techniques that extract maximum performance from them. Micron offers one of the few environments where hardware engineers work at the intersection of process technology and circuit design — a rare combination that develops highly specialized expertise.
Micron Technology is one of only three DRAM manufacturers in the world (alongside Samsung and SK Hynix), and a major NAND Flash producer. Its Boise, Idaho headquarters houses its largest engineering organization, and its HBM memory products are qualified for NVIDIA H100 and AMD MI300 AI accelerators.
Apply at Micron Careers. Search "Hardware Design Engineer." The technical interview covers CMOS circuit design fundamentals, memory architecture basics, and a simulation exercise. Some roles include a take-home circuit analysis problem before the final loop.
| Salary | $40 – $58 / month |
|---|---|
| Job Type | Full-time |
| Work Mode | Hybrid |
| Location |
Boise, ID San Jose, CA Longmont, CO Manassas, VA Austin, TX |
| Apply Before | Jul 09, 2026 |